Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
Design of printed boards and printed board assemblies
requires a complete understanding of the board manufacturing
process and the assembly and joining processes.
Designers must consider manufacturing allowances for
conductor definition and plated-through hole to land relationships
in order to ensure adequate annular ring definition.
In addition, proper clearances for automatic component
insertion or placement equipment heads must be
accommodated