IPC DD-135-1995
Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

Standard No.
IPC DD-135-1995
Release Date
1995
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.



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