Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
This document is the product of the IPC Electrochemical
Migration (ECM) Task Group. It was drafted to provide
guidance regarding how the IPC-TM-650, Method 2.6.25,
Conductive Anodic Filament (CAF) Resistance test can
best be used for evaluating the effects of mechanical stress,
laminate material fracturing, ionic contamination, moisture
content prior to press lamination, and other material processing
characteristics on conductive anodic filament
(CAF) growth. This CAF test method provides a proven
standard for determining the risk of THB failure within
rather than on the surface of printed circuit boards (PCBs),
typically filament formation along the boundary between
the resin and laminate reinforcement.