(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Status
Scope
Many companies in the electronics industry have adopted tin-based surface finishes as one of the
methods to comply with various legislative lead-free (Pb-free) initiatives, e.g., the European
Union’s RoHS directive. However, tin (Sn) and tin alloy surface finishes may be prone to tin
whisker formation with associated possible reliability degradation. Appropriate mitigation
practices, as described in JEDEC guidance document JP002, may be incorporated to reduce tin
whisker propensity to an acceptable level.