(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Status
Scope
This document shall apply to all electronic components including passives, connectors, solid state
components and other devices which use solder to attach the device/component to the board or assembly.
This standard applies to bumped die that are used for direct board attach (COB). This standard presumes
that the surface finish of bare boards (PCB), package substrates, etc. is Pb-free.