JEDEC JESD63-1998
Standard Method for Calculating the Electromigration Model Parameters for Current Density and Temperature

Standard No.

JEDEC JESD63-1998

Release Date

1998

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Scope

Electromigration is a failure mechanism of electrical interconnects that is of great concern, especially for the reliability assessment of very large scale integrated (VLSI) microelectronics. The drivers of the electromigration process in Black's equation are the current density and the temperature.