(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Status
Scope
As the copper damascene technology has gained widespread use for ULSI interconnections, a renewed
interest has developed in fast wafer level reliability (WLR) measurements to evaluate electromigration.
The standard package level reliability (PLR) tests, used in the semiconductor industry, are very expensive
when applied to copper metallizations, in comparison with aluminum-based structures, due to the
considerable cost of the high temperature environmental chambers required (a typical stress temperature
is 350 °C) and to the time (weeks, months) required to perform some characterizations.