(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Status
Scope
This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages,
which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this
document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials.
The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture
sensitivity of their product devices, and by board assembly operations to ensure that proper handling precautions are
applied to moisture/reflow sensitive devices. If no major changes have been made to a previously qualified SMD package,
this method may be used for reclassification according to 4.2.