JEDEC JESD33B-2004 Standard Method for Measuring and Using the Temperature Coefficient of Resistance to Determine the Temperature of a Metallization Line
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Scope
This method is intended for determining the temperature coefficient of resistance (at a given temperature)
of aluminum- and copper-based thin-film metallizations that are used in microelectronic circuits and
devices.
This method is intended for estimating a mean temperature of a metallization line stressed in an
accelerated electromigration stress test before any irreversible change in resistivity occurs due to the
current-density and temperature stresses imposed.
This method is intended for using a metallization test line as an ambient-temperature sensor. It uses the
predetermined values for the temperature coefficient of resistance of the metallization and the resistance
of the test line at a reference temperature.
This method is designed for use under conditions where the metallization resistivity is linearly dependent
on temperature and where it does not suffer any irreversible changes. For aluminum metallizations, a
linear dependence appears to hold until approximately 420 ºC, considerably above anticipated stress
temperatures. For copper metallizations, a departure from a linear dependence becomes evident at
temperatures as low as 200 °C. A correcting function is used for copper to correct for departures from
linearity at these higher temperatures
This method is applicable to metallization test lines with or without vias, and with oxide or low-k
dielectrics.
While the method is designed for use with aluminum- and copper-based metallizations, it may also be
used with other metals and alloys for conditions that satisfy the linear dependence and stability
stipulations in the previous paragraphs.
The metallization structure used in the method may be measured while on a wafer or a part therefrom, or
as part of a test chip bonded to a package and electrically accessible via package terminals.