(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Status
Scope
The typical use of surface mount devices (SMD) involves subjecting the SMDs to elevated
temperatures during board assembly, which combined with moisture in the package can induce
internal package damage that could be a reliability concern. Preconditioning of SMD packages
is used to simulate the effects of board assembly on moisturized packages, prior to reliability
testing. This allows reliability testing at the component level on as shippable products with a
board assembly simulation. During preconditioning, test samples are subjected to temperature
cycling (optional), dry bake, moisture soaking, solder reflow simulation, flux, rinse, dry, and
electrical test before reliability testing.