ECA 540HAAA-2000
Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment

Standard No.

ECA 540HAAA-2000

Release Date

2000

Published By

Electronic Components, Assemblies and Materials Association

Scope

The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification have Maximum enclosure dimensions as shown in figure 2.