KS C IEC 60249-2-8-2013
Base materials for printed circuits－Part 2：Specifications－ Specification No.8：Flexible copper－clad polyester(PETP) film

Standard No.

KS C IEC 60249-2-8-2013

Release Date

2013

Published By

Korean Agency for Technology and Standards (KATS)

Latest

KS C IEC 60249-2-8-2013

Introduction

This standard specifies the requirements for flexible copper-clad polyethylene terephthalate (PETP) film substrates used in printed circuit boards. It includes details on material properties, dimensions, and performance criteria necessary to ensure the quality of these substrates. The document is part of a series addressing various types of materials and specifications relevant to printed circuit board technology.

*** Please note: This description may not be accurate, please refer to the official documentation.

KS C IEC 60249-2-8-2013 history

• 2013 KS C IEC 60249-2-8:2013 Base materials for printed circuits－Part 2：Specifications－ Specification No.8：Flexible copper－clad polyester(PETP) film
• 0000 KS C IEC 60249-2-8-2002(2012)
• 2002 KS C IEC 60249-2-8:2002 Base materials for printed circuits-Part 2:Specifications- Specification No.8:Flexible copper-clad polyester(PETP) film

Standard and Specification