T/ICMTIA CM0035-2023
Sealing gasket for semiconductor silicon material process device (English Version)

Standard No.
T/ICMTIA CM0035-2023
Language
Chinese, Available in English version
Release Date
2023
Published By
Group Standards of the People's Republic of China
Latest
T/ICMTIA CM0035-2023
 

Scope
Semiconductor material purification is an important foundation for the development of semiconductor devices. Due to the process requirements of large-scale and very-large-scale integrated circuits, the high purity of raw materials and intermediate products and the high cleanliness of production environments have become significant issues affecting product quality. Trace amounts of impurities can severely impact the characteristics of semiconductors and the yield rate of chips. Therefore, strict control over impurities is necessary during the production process of semiconductor materials and components. As an important component of bolt flange seal combinations, the sealing performance, reliability, and cleanliness of gaskets also affect the stability of the manufacturing process and product quality. Gaskets are widely used and essential in the semiconductor silicon material industry. However, there has been no clear technical specification for gaskets used in the manufacture of semiconductor silicon materials processes and pipelines—no specific type, quality requirements, performance parameters, or cleanliness standards have been established. To adapt to current industrial practices and avoid affecting finished product quality due to gasket quality issues, this document is specially compiled. This document aims to establish the necessary requirements for the design, manufacturing, performance, and selection of gaskets used in semiconductor silicon material processing equipment.

T/ICMTIA CM0035-2023 history


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