IPC - Association Connecting Electronics Industries
Scope
This test method covers three procedures used to determine the bow and twist percentage of individual rigid printed boards@ rigid portions of rigid-flex printed boards@ and/or multiple printed panels. Measurements on non-rectangular samples pose a unique testing problem and may necessitate careful evaluation of the requirements imposed by the users of this test method. This test method does not describe the special considerations necessary when testing the bow and twist of printed board assemblies (i.e.@ component placement weight@ edge supports connectors@ etc.).The first two procedures describe production (Go/No-Go) methods that generally characterize the bow and twist as being no more than a specific value. The other procedure is a referee method used to precisely determine the twist.