GB/Z 41275.23-2023
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronics (English Version)

Standard No.
GB/Z 41275.23-2023
Language
Chinese, Available in English version
Release Date
2023
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/Z 41275.23-2023
 

GB/Z 41275.23-2023 history

  • 2023 GB/Z 41275.23-2023 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronics

Standard and Specification

GSO IEC/TS 62647-23:2015 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address TS 62647-23-2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address SAE GEIAHB0005_3-2015 Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems GEIA-HB-0005-3-2008 Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems PAS 62647-23-2011 Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 23: Rework and repair guidance to address STANREC 4736-2012 Composants électroniques sans plomb Risques et mesures d’atténuation (ED 1 STANREC 4736-2016 ASSEMBLAGES DE COMPOSANTS ?LECTRONIQUES SANS PLOMB RISQUES ET MESURES D’ATT?NUATION (ED 2 PAS 62647-3-2011 Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 3: Performance testing for systems containing lead GSO IEC/TS 62647-3:2014 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead


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