NF EN IEC 63215-2:2023 Endurance test methods for chip attach materials - Part 2: Thermal cycle test method for chip attach materials, applied to discrete type power electronic devices
This document specifies the thermal cycling test method for chip interconnection materials used in discrete power electronic devices. It is part of a series of standards that provide methods to assess the durability of these materials under various conditions, focusing specifically on the effects of temperature changes over time.
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NF EN IEC 63215-2:2023 history
2023NF EN IEC 63215-2:2023 Endurance test methods for chip attach materials - Part 2: Thermal cycle test method for chip attach materials, applied to discrete type power electronic devices