IPC J-STD-006C-2013
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
- Standard No.
- IPC J-STD-006C-2013
- Release Date
- 2013
- Published By
- IPC - Association Connecting Electronics Industries
- Scope
- This standard prescribes the nomenclature@ requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar@ ribbon@ wire@ and powder solders@ for electronic soldering applications; and for ????special form'' (see 1.2.3) electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry. The other two joint industry standards are: J-STD-004 Requirements for Soldering Fluxes -STD-005 Requirements for Soldering Pastes
