IPC TM-650 2.4.13F-1998
Solder Float Resistance Flexible Printed Wiring Materials

Standard No.

IPC TM-650 2.4.13F-1998

Release Date

1998

Published By

IPC - Association Connecting Electronics Industries

Scope

This test method establishes and defines the procedures for determining the solder float resistance of copper foil clad and bare flexible dielectric material.