IPC J-STD-006B AMD 1-2008
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1

Standard No.
IPC J-STD-006B AMD 1-2008
Release Date
2008
Published By
IPC - Association Connecting Electronics Industries
Scope
This standard prescribes the nomenclature@ requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar@ ribbon@ and powder solders@ for electronic soldering applications; and for ??special?? electronic grade solders. This is a quality control standard and is not intended to relate directly to the material??s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.This standard is one of a set of three joint industry standards the prescribe the requirements and test methods for soldering materials for use in the electronics industry:IPC/EIA J-STD-004 Requirements for Soldering FluxesIPC/EIA J-STD-005 Requirements for Soldering PastesIPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.



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