IPC 9111-CHINESE-2019
Fault Isolation and Performance Specifications for High-Frequency (Microwave) Printed Boards
- Standard No.
- IPC 9111-CHINESE-2019
- Release Date
- 2019
- Published By
- Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- Latest
- IPC 9111-CHINESE-2019
- Introduction
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Standard Name: Troubleshooting in Printed Circuit Board Assembly Processes
Standard Number: IPC-9111 CN
Scope of Application: This international standard, developed by IPC, focuses on the principles of standardization to guide the design for manufacturability (DFM) and design for environment (DFE). It aims to minimize time-to-market, use simplified language, and focus on the performance of the final product. The standard also provides a feedback system for applications and issues to facilitate future improvements.
Analysis: The IPC-9111 CN standard is a comprehensive guide for troubleshooting in the assembly processes of printed circuit boards. It emphasizes the importance of standardization in enhancing product interchangeability and improving product quality. The standard also encourages innovation while ensuring that the processes are efficient and cost-effective. It is voluntary for users and suppliers to adopt this standard, and it is recommended to use the latest version for optimal results. The development of this standard involves extensive review and contributions from industry experts, ensuring its relevance and applicability in the electronics manufacturing sector.
IPC 9111-CHINESE-2019 history
- 2019 IPC 9111-CHINESE-2019 Fault Isolation and Performance Specifications for High-Frequency (Microwave) Printed Boards
