This document establishes the procedure for testing@ and characterizing the electrostatic discharge (ESD) sensitivity of component pins that will be directly connected to external connectors or ports on a completed system. This method is not intended for ESD testing of device@ module@ or component pins that do not directly connect to a system port or connector. This document covers testing under un-powered and powered states but does not cover testing of integrated circuits in a functioning state. For the purposes of this document@ the HMM test pulse will be modeled after the contact discharge defined by the IEC 61000-4-2 document. Purpose The purpose of this document is to establish a test method for stressing pins of electrical components such as integrated circuits@ protection elements@ or filters that will be directly connected to external ports of a system and may be subjected to a system level type ESD stress waveform. This document is not intended to prove that a component will survive stress of a specified level within a completed system or to estimate the protection level from ESD that is incorporated within a system. Variations in system design@ component level packaging and the individual part response to an ESD stress make such predictions impossible with a single test. The objective of this test is to provide a baseline for characterization of ESD protection on device pins prior to incorporation of those devices or components into the completed system. NOTE: Component testing to this procedure will not predict how the component will react to system level tests according to IEC 61000-4-2.