IPC - Association Connecting Electronics Industries
Scope
Purpose The purpose of this document is to define a Process Capability@ Quality@ and Relative Reliability (PCQR2) Benchmark Test Standard and Database subscription system for the evaluation of printed wiring board manufacturing processes and the mechanism that allows the comparative data to be accessible industry wide. This is in accordance with The National Technology Roadmap for Electronic Interconnections 2000/2001 published by IPC@ which states that ????For a company to efficiently manage its supply chain it must identify the capability of its suppliers and make certain that their capability for manufacturing a product is consistent with the needs of the customer.???? Documentation Hierarchy All other IPC documents take precedence over this document. This document describes a process to evaluate the manufacturing capability of key attributes specified in the design and acceptability standards controlled by IPC. Definition of Terms Conductor Analysis Technologies Inc. (CAT Inc.) The company providing and controlling the intellectual property associated with the PCQR2 process capability panels@ data analysis techniques@ and database. Printed Wiring Board Fabricator A company or organization that manufactures printed wiring boards. Database Supplier A fabricator that submits one or more lots of PCQR2 process capability panel designs for testing and analysis. Database Subscriber An Original Equipment Manufacturer (OEM)@ Original Design Manufacturer (ODM)@ Electronic Manufacturing Services (EMS) provider or other company associated with the electronics industry that pays an annual fee to obtain access to the PCQR2 database. Manufacturing Facility The physical site of a company or organization that fabricates the PCQR2 process capability panels. Process Capability Panel A parametric test panel that is comprised of test modules designed to evaluate specific characteristics of printed wiring board manufacturing processes. Test Module The individual element of a process capability panel. Design Library The family of available process capability panel designs developed by the D-36 Subcommittee. Design Documentation File The file used to detail the manufacturing requirements and specification of each process capability panel design. CAT Analysis Report Detailed data on each printed wiring board fabricator??s process capability@ quality and relative reliability. Process Capability Data The process capability@ quality and relative reliability data generated from the testing of PCQR2 process capability panels. Supplier Comparison Report Comparative data of each printed wiring board fabricator participating in the PCQR2 database. This report is only accessible by subscribers. PCQR2 Database The electronic storage medium for the data and reports generated from the testing of PCQR2 process capability panels. Valid Data The data in the Supplier Comparison Report remains active for a period of only twelve months. The data in the Industry Statistics Report will be used for a period of twenty-four months from the posting date. Industry Statistics Statistical data on the industry??s process capability@ quality and relative reliability. Annual Subscription License The method used by subscribers to gain access to the PCQR2 Database. Subscription Fee The fee paid by subscribers to access the PCQR2 Database. Supplier Information Form The form filled out by fabricators upon submitting panels to the database@ with pertinent information including board fabrication company and facility@ contacts@ via structures@ fabrication materials and stackup. Highly Accelerated Thermal Shock (HATS) An air-to-air reliability test methodology based on traditional air-to-air thermal cycling. The method uses a single chamber in which high volume hot and cold air alternately pass stationary samples providing rapid thermal transfer and reducing the time for the samples to reach temperature equilibrium. The samples are fixtured to a high-speed precision resistance sampling network allowing continuous monitoring of the samples during the temperature cycles.