BS IEC 62047-43:2024
Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
- Standard No.
- BS IEC 62047-43:2024
- Release Date
- 2024
- Published By
- British Standards Institution (BSI)
- Latest
- BS IEC 62047-43:2024
- Introduction
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Standard Name: Semiconductor devices — Micro-electromechanical devices Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
Standard Number: BS IEC 62047‑43:2024
Scope: This standard specifies the test method for evaluating the electrical characteristics of flexible micro-electromechanical devices after cyclic bending deformation. It is applicable to devices that undergo repeated mechanical stress, ensuring their reliability and performance under such conditions.
Analysis: The BS IEC 62047‑43:2024 standard provides a critical framework for testing the durability and electrical performance of flexible micro-electromechanical devices under cyclic bending conditions. This is essential for industries relying on MEMS technology, such as consumer electronics, medical devices, and automotive systems, where mechanical flexibility and electrical reliability are paramount. By standardizing the test method, it ensures consistent evaluation and quality assurance across different manufacturers and applications.
BS IEC 62047-43:2024 history
- 2024 BS IEC 62047-43:2024 Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
