IPC - Association Connecting Electronics Industries
Status
2006-12
Scope
INTRODUCTIONThis document is intended to serve as a user's guide for the manipulation of data contained in spreadsheet format that supports the concepts and methodology for developing surface mount land patterns that are identified in IPC-SM-782@ "Surface Mount Design and Land Pattern Standard."The information contained in the various files of the disk provide the appropriate size@ shape@ and tolerance of surface mount land patterns that insure sufficient area for the formation of appropriate solder fillets@ that permit inspection and testing of those solder joints.The equations built into the spreadsheet format follow the principles delineated in IPC-SM-782. They have been organized into various columns and rows for ease of use in both understanding the principles@ and allowing users of the disk to manipulate the data to achieve optimum solder joint formation for their particular projects.The data reflects the printed and agreed to land pattern sizes. Each land pattern has been registered with its own number in a significant numbering system that correlates a land pattern to a specific surface mount component. Although there are three performance classes identified in IPC-SM-782@ the land patterns described by the data contained in the spreadsheets have the capability of accommodating all three performance classifications.