GB/T 43536.2-2023
3D Integrated Circuits Part 2: Calibration Requirements for Fine Pitch Stacked Chips (English Version)

Standard No.
GB/T 43536.2-2023
Language
Chinese, Available in English version
Release Date
2023
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 43536.2-2023
 

GB/T 43536.2-2023 history

  • 2023 GB/T 43536.2-2023 3D Integrated Circuits Part 2: Calibration Requirements for Fine Pitch Stacked Chips

Topics on standards and specifications

Microwave integrated circuit chip universal

Standard and Specification

IPC SMC-WP-003-1993 Chip Mounting Technology (CMT DIN EN 62148-21:2017 Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using Silicon Fine IEC 62148-21:2021 Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon IPC 3408-1996 General Requirements for Anisotropically Conductive Adhesive Films IPC TM-650 2.5.5.10-2005 High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials IPC MI-660 6.3-1984 Electroless Plating Chemicals IPC MI-660 10.0-1984 Other Materials IPC TM-650 2.3.21-1997 Plating Quality Hull Cell Method Revision IEC 62148-21:2019 Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine EN IEC 62148-21:2019 Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine

GB/T 43536.2-2023 -All Parts

GB/T 43536.1-2023 Three-dimensional Integrated Circuits Part 1: Terms and Definitions GB/T 43536.2-2023 3D Integrated Circuits Part 2: Calibration Requirements for Fine Pitch Stacked Chips


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