The standard T/CEMIA 037-2023, published on November 14, 2023 and implemented since December 30, 2023, sets out specifications for silver-palladium thick film conductive paste used in integrated circuit manufacturing. This document establishes guidelines for the material composition, physical properties, chemical analysis methods, performance indicators, and testing procedures of this specialized paste. It aims to ensure consistent quality and reliability in the production of thick film circuits with silver-palladium conductors, thereby contributing to advancements in semiconductor technology and electronic device manufacturing.
*** Please note: This description may not be accurate, please refer to the official documentation.
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