T/CEMIA 037-2023
Specification for silver-palladium conductor pastes for thick film integrated circuits (English Version)

Standard No.
T/CEMIA 037-2023
Language
Chinese, Available in English version
Release Date
2023
Published By
Group Standards of the People's Republic of China
Latest
T/CEMIA 037-2023
 

Introduction

The standard T/CEMIA 037-2023, published on November 14, 2023 and implemented since December 30, 2023, sets out specifications for silver-palladium thick film conductive paste used in integrated circuit manufacturing. This document establishes guidelines for the material composition, physical properties, chemical analysis methods, performance indicators, and testing procedures of this specialized paste. It aims to ensure consistent quality and reliability in the production of thick film circuits with silver-palladium conductors, thereby contributing to advancements in semiconductor technology and electronic device manufacturing.

T/CEMIA 037-2023 history

  • 2023 T/CEMIA 037-2023 Specification for silver-palladium conductor pastes for thick film integrated circuits

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