The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification have: ?? Maximum enclosure dimensions as shown in figure 2. ?? A working voltage not exceeding 250 volts (rms). ?? Current rating not exceeding 1 ampere per pin. Object The object of this Detail Specification is to provide all information required for the identification and quality assessment of the burn-in socket for ball grid array devices described herein by the EIA. The information@ contained herein or by reference@ is complete and sufficient for inspection purposes.