IPC - Association Connecting Electronics Industries
Scope
Moisture absorption can cause delamination or other damage in printed boards subjected to soldering heat. This test is a process control tool to determine both the bulk moisture content and moisture absorption rate of a printed board. It may be used to determine whether the specimen conforms to the monitoring level of the user's performance specification@ to assist in process development@ or for process control. This test may not provide accurate analytical results on all specimens@ depending on the thickness of the item@ the presence of copper layers or other moisture barriers within the structure@ or the presence of any volatile compounds other than water. The weight of the specimen is compared before and after a bake operation. The bake is intended to remove most of the water (> 90%) from the sample@ and the bake time and temperature specified herein are minimums. To improve test accuracy@ or to prevent heat damage@ other bake parameters may be as agreed between user and supplier (AABUS).