The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions (See Figure 1.) b) Working voltage not to exceed ____volts (mis). c) Current not to exceed ____amperes per pin. OBJECT The object of this Detail Specification is to provide all information required for@ using Sectional Specification Eh-540F000 as a base@ for the identification and quality assessment of Multi- Package Module sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.