IPC - Association Connecting Electronics Industries
Scope
This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly@ including plastic encapsulated packages@ process sensitive devices@ and other moisture sensitive devices made with moisture-permeable materials (epoxies@ silicones@ etc.) that are exposed to the ambient air. Purpose The purpose of this document is to provide manufacturers and users with standardized methods for handling@ packing@ shipping@ and use of moisture eflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures@ safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.