IPC/JEDEC J-STD-033B-2005
Handling@ Packing@ Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

Standard No.
IPC/JEDEC J-STD-033B-2005
Release Date
2005
Published By
IPC - Association Connecting Electronics Industries
Scope
PackagesNonhermeticThis standard applies to all nonhermetic SMD packages subjected to bulk solder reflow processes during PCB assembly@ including plastic encapsulated packages and all other packages made with moisture-permeable polymeric materials (epoxies@ silicones@ etc.) that are exposed to the ambient air.HermeticHermetic SMD packages are not moisture sensitive and do not require moisture precautionary handling.



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