EIA CB-5-1:1971
Recommended Test Procedure for Semiconductor Thermal Dissipating Devices (Addendum to Bulletin No.5; (STABILIZED))

Standard No.

EIA CB-5-1:1971

Release Date

1971

Published By

ECIA - Electronic Components Industry Association

Scope

The scope of this supplement to EIA Components Bulletin No. 5 is to present methods of instrumentation for plastic case semiconductors and integrated circuits for evaluation of thermal dissipating devices.