For high pin count components (e.g.@ ball grid array) with a large number of signal pins@ the total number of pins can be reduced by splitting the signal pins into two or more equal sets or subgroups. Special test fixture boards (TFBs) can be constructed to connect each set of signal pins to specific tester channels while floating the remaining unused signal pins. Additional TFBs can be constructed to connect each remaining set of signal pins to specific tester channels while floating the remaining unused signal pins. All power@ ground and control pins on the component should be wired to each TFB. NOTE: ANSI/ESD SP5.2.2 does not cover the testing of supply pins of high pin count devices. It is recommended to use ANSI/ESD SP5.2.1. Purpose This standard practice establishes an alternative test method to perform Machine Model (MM) component level electrostatic discharge (ESD) tests when the component or device pin count exceeds the ESD simulator tester channels. This alternative test method is limited to components with greater than 512 pins or balls. Since many of the tester parasitic properties of a higher pin count ESD simulator cannot be reproduced using a low pin count ESD simulator@ the test results will be similar@ but not identical. This document references ANSI/ESD STM5.2 (MM) test method. ANSI/ESD STM5.2 ?C Machine Model will override this standard practice (ANSI/ESD SP5.2.2) if there are any conflicts in testing a component. If an ESD simulator above 512 pins is not available@ then this standard practice can be used as a guide to ESD stress components with greater than 512 pins or balls using a lower pin count ESD simulator.