EIA-747-B-2014
Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0mm Thick

Standard No.
EIA-747-B-2014
Release Date
2014
Published By
ECIA - Electronic Components Industry Association
Scope
This Standard covers requirements for 8mm@ 12mm@ 16mm and 24mm taping of surface mount components generally less than 1.0mm thick and requiring high precision taping for automatic handling of devices such as singulated bare die and other surface mount components. Refer to EIA-481 for the current Industry Standard for 8mm and 12 mm punched and 8mm to 24mm embossed taping requirements.



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