IPC 9701A-CHINESE-2006
Surface Mount Technology (SMT) Reliability Testing Methods and Acceptance Requirements
- Standard No.
- IPC 9701A-CHINESE-2006
- Release Date
- 2006
- Published By
- Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- Introduction
-
Standard Name: Performance Test Methods and Qualification Requirements for Surface Mount Solder Joints
Standard Number: IPC-9701A CN
Scope of Application: This standard provides performance test methods and qualification requirements for surface mount solder joints. It is developed by the IPC Product and Reliability Committee (6-10) and the SMT Connection Reliability Test Methods Task Group (6-10d). The translation was done by the IPC TGAsia 6-10dCN Technical Group.
Analysis: The IPC-9701A CN standard outlines the methodologies and criteria for testing and qualifying surface mount solder joints, which are crucial for ensuring the reliability and performance of electronic assemblies. The standard emphasizes the importance of manufacturability and environmental considerations, aiming to minimize time-to-market and use simplified language. It focuses on the performance of the final product and provides a feedback system for future improvements. The standard is voluntary and serves as a guideline for manufacturers, users, and suppliers to better understand each other, thus promoting efficiency and cost-effectiveness. The development and maintenance of the standard involve extensive volunteer work and financial investment, highlighting the collaborative effort within the electronics industry to uphold quality and reliability standards.
