IPC TM-650 2.6.14D-2007
Solder Mask - Resistance to Electrochemical Migration

Standard No.

IPC TM-650 2.6.14D-2007

Release Date

2007

Published By

IPC - Association Connecting Electronics Industries

Scope

This test method is used to determine the ability of a polymer solder mask protective coating to withstand an environment conducive to electrochemical migration.