IEEE P370/D5-2019
Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz

Standard No.
IEEE P370/D5-2019
Release Date
2019
Published By
IEEE - The Institute of Electrical and Electronics Engineers@ Inc.
Scope
This document addresses the quality of measured S parameters for electrical printed circuit board (PCB) and related interconnect at frequencies up to 50 GHz. This might include but is not limited to: test fixturing@ methods and processes for controlling the accuracy and consistency of measured data for broadband signals with frequency content up to 50 GHz. The standard is applicable to: PCB and related interconnects (including package@ connector@ cable@ etc.) used in high speed digital applications@ operating with signals at frequencies up to 50 GHz; most industries using such interconnects; major measurement approaches (Time Domain or Frequency Domain) for collecting S-Parameter data; significant methods of removing/deembedding fixture and instrumentation effects. Purpose The purpose of this standard is to define methodologies by which high-quality scattering parameters (S parameters) can be obtained for electrical interconnects that are intended to operate at microwave frequencies (up to 50 GHz). The standard methodology includes requirements for designing test fixtures@ performing measurements@ removing test fixture and instrumentation effects@ and verifying the quality of the final S-parameters. Although the highest frequency of interest is set at 50 GHz in this document@ the methodology is generally applicable to higher frequencies. The methods and techniques contained herein have only been validated to 50 GHz as of this writing.



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