| Security Capability Level | Operating Environment | Key Storage Location | Typical Application Scenarios |
|---|---|---|---|
| TEE+SE | REE+TEE+SE Three Environments Collaboration | SE Security Chip | Large Amount Transfer/Cross-border Payment |
| TEE | REE+TEE Dual Environment | TEE Security Zone | Daily Small Amount Payment |
Must meet GB/T 41388-2022 specifications and have:
Should comply with JR/T 0098 series testing requirements:
Mainstream solutions such as Huawei Kirin chips must pass:
| Phase | Key tasks | Time nodes |
|---|---|---|
| 1.Terminal adaptation | Connect with TEE interface of manufacturers such as Xiaomi/OPPO | Q1-Q2 |
| 2.CA system transformation | Support mobile certificate issuance/revocation | Q3 |
| 3.Risk control system upgrade | Establish transaction behavior analysis model | Q4 |
Compared with the 2012 version of the mobile payment standard, the main breakthroughs are:

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