PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate

Standard No.
PD IEC TS 62878-2-10:2024
Release Date
2024
Published By
British Standards Institution (BSI)
Latest
PD IEC TS 62878-2-10:2024
 
Scope
This document provides a general specification for the design of cavity substrates.

PD IEC TS 62878-2-10:2024 Referenced Document

PD IEC TS 62878-2-10:2024 history

Device embedding assembly technology Part 2-10: Design specification for cavity substrate

Standard and Specification

IEC TS 62878-2-10:2024 Device embedding assembly technology - Part 2-10: Design specification for cavity substrate BS PD IEC TS 62878-2-10:2024 Device embedding assembly technology-Part 2-10: Design specification for cavity substrate IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate BS EN IEC 62878-2-5:2019 Device embedding assembly technology - Guidelines. Implementation of a 3D data format for device embedded substrate BS EN 62878-1-1:2015 Device embedded substrate - Generic specification. Test methods BS EN IEC 62878-1:2019 Device embedding assembly technology - Generic specification for device embedded substrates TS 62878-2-3-2015 Substrat avec appareil(s) intégré(s) – Partie 2-3: Directives – Guide de conception (Edition 1.0 DIN EN IEC 62878-2-602 E:2020-11 Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates


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