EIA-540HA00-2000
Blank Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment

Standard No.
EIA-540HA00-2000
Release Date
2000
Published By
ECIA - Electronic Components Industry Association
Scope
The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification shall have: ?? Maximum enclosure (maximum length@ width and height dimensions). ?? A working voltage not exceeding___ volts (rms). ?? Current not exceeding __ ampere per pin.



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