EIA-800-1999
Integrated Passive Device (IPD) Chipscale Package Design Guidelines

Standard No.

EIA-800-1999

Release Date

1999

Published By

ECIA - Electronic Components Industry Association

Scope

Introduction This guideline is intended to facilitate a common industry direction with regard to IPD chipscale packaging. This guideline is not intended to document special product designs that are supplier?Ccustomer unique.