IPC TM-650 2.4.21F-2007
Land Bond Strength@ Unsupported Component Hole

Standard No.

IPC TM-650 2.4.21F-2007

Release Date

2007

Published By

IPC - Association Connecting Electronics Industries

Scope

This test method is to determine the land bond strength of unsupported holes@ after repeated soldering and unsoldering@ by mechanical pull in the perpendicular plane.