IPC J-STD-006B AMD 1 & 2-2009
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Standard No.
IPC J-STD-006B AMD 1 & 2-2009
Release Date
2009
Published By
IPC - Association Connecting Electronics Industries
Scope
This standard prescribes the nomenclature@ requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar@ ribbon@ and powder solders@ for electronic soldering applications; and for ????special'' electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry. The other two joint industry standards are: IPC/EIA J-STD-004 Requirements for Soldering Fluxes IPC/EIA J-STD-005 Requirements for Soldering Pastes Additionally@ marking requirements for lead-free materials and assemblies is addressed in this document by direct application of text from IPC/JEDEC J-STD-609@ Lead- Free and Leaded Marking@ Symbols and Labels (see 6.5).



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